ASMPT has secured new orders for 19 Chip-to-Substrate (C2S) Thermo-Compression Bonding (TCB) tools from a major OSAT partner in the AI chip market, solidifying its position as the sole supplier and Process of Record (POR) for C2S TCB solutions. This partnership emphasizes ASMPT’s leadership in advanced packaging solutions tailored for high-volume manufacturing, particularly as logic applications involve larger compound die sizes. Robin Ng, Group CEO of ASMPT, highlighted the transformative growth of the TCB market driven by AI and high-performance computing (HPC) needs. With over 500 TCB tools installed globally, ASMPT is poised to capture 35-40% of the expanding TCB market, projected to exceed $1 billion by 2027 due to rising investments in the AI ecosystem. This ongoing success reaffirms ASMPT’s commitment to delivering scalable, production-ready technology for its customers’ advanced packaging demands.
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