Lee Goldberg is a multifaceted professional with backgrounds in engineering and journalism, self-described as a “Recovering Engineer” and a Maker/Hacker. His initial 18-year career involved designing microprocessors, embedded systems, and renewable energy technologies, even contributing to interplanetary spacecraft. Transitioning to tech journalism, he has spent the last 20 years covering engineering topics across various publications, with a focus on power electronics, energy efficiency, and sustainable technologies. His interests include 3D printing and open-source hardware. Lee holds a BSEE in Electrical Engineering from Thomas Edison College and engaged in discussions on technology and ecology at Goddard College. He authored “Green Electronics/Green Bottom Line,” emphasizing environmentally responsible engineering. Residing in suburban Princeton, N.J., with his family, he also writes a regular column called PowerBites, exploring relevant engineering and tech topics.
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High-Density Power Module from Microchip: Optimized for AI-Edge Applications
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