Quectel Wireless Solutions has launched its new flagship smart module, the SP895BD-AP, powered by the Qualcomm Dragonwing™ Q-8750 processor built on a 3nm architecture. This innovative module enhances smartphone-class computing and graphics for embedded and industrial applications, shifting workloads from the cloud to on-device processing. With an 8-core Oryon™ CPU, it achieves a 45% increase in CPU performance and 44% energy efficiency, ideal for multi-tasking and complex algorithms. The Adreno™ Series 8 GPU boosts graphics performance by 40%, supporting lifelike rendering for UHD (8K/3D) displays. The SP895BD-AP also supports 8K video processing, catering to high-end use cases in retail, smart devices, and video conferencing. It features a compact LGA form factor with versatile interfaces (MIPI, PCIe, USB) and compatibility with Android 15 and Linux, enhancing adaptability for various IoT applications. This module sets a new benchmark in multimedia processing for the industry.
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