SIMCom, a leader in IoT solutions, introduces two new compact smart AI modules—SIM8666 and SIM8668—designed for emerging imaging applications. These modules, measuring 43 x 44 x 3.2mm, integrate an AI core, MCU, and connectivity via Wi-Fi and Bluetooth, simplifying the addition of AI imaging functionalities. Equipped with Rockchip’s 64-bit quad-core RK3566/RK3568 chips and an ARM Mali-G52 GPU, they support advanced multimedia capabilities, including 4K@60fps decoding and versatile encoding options. With rich interface support, such as LVDS, HDMI2.0, and USB, these modules excel in multi-dimensional data collection and human-machine interaction. Target applications span IoT gateways, smart displays, industrial control, and smart security—making them ideal for rapid development of cost-effective, high-performance solutions for various industries. Visit SIMCom at Embedded World (Booth 3-525) in Nuremberg, Germany, from March 10-12, 2026, to learn more. For details, visit www.simcom.com.
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